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MC33375, NCV33375 Series 300 mA, Low Dropout Voltage Regulator with On/Off Control
The MC33375 series are micropower low dropout voltage regulators available in a wide variety of output voltages as well as packages, SOT-223 and SOP-8. These devices feature a very low quiescent current and are capable of supplying output currents up to 300 mA. Internal current and thermal limiting protection are provided by the presence of a short circuit at the output and an internal thermal shutdown circuit. The MC33375 has a control pin that allows a logic level signal to turn-off or turn-on the regulator output. Due to the low input-to-output voltage differential and bias current specifications, these devices are ideally suited for battery powered computer, consumer, and industrial equipment where an extension of useful battery life is desirable.
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LOW DROPOUT MICROPOWER VOLTAGE REGULATOR
MARKING DIAGRAMS
4 1 SOT-223 ST SUFFIX CASE 318E 1
* Low Quiescent Current (0.3 mA in OFF mode; 125 mA in ON mode) * Low Input-to-Output Voltage Differential of 25 mV at IO = 10 mA, * * * * * *
and 260 mV at IO = 300 mA Extremely Tight Line and Load Regulation Stable with Output Capacitance of only 0.33 mF for 2.5 V Output Voltage Internal Current and Thermal Limiting Logic Level ON/OFF Control Pb-Free Packages are Available NCV Prefix for Automotive and Other Applications Requiring Site and Control Changes
Vin Thermal & Anti-sat Protection Rint On/Off Block 1.23 V V. Ref. 54 K This device contains 41 active transistors GND Vout SOIC-8 D SUFFIX CASE 751
AYM 375xx G G
8 8 1 375xx ALYW G 1 A = Assembly Location Y = Year M = Date Code L = Wafer Lot W = Work Week xx = Voltage Version G = Pb-Free Package (Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 11 of this data sheet.
On/Off
Figure 1. Simplified Block Diagram
(c) Semiconductor Components Industries, LLC, 2009
May, 2009 - Rev. 12
1
Publication Order Number: MC33375/D
MC33375, NCV33375 Series
PIN CONNECTIONS
Gnd 4 Input Gnd Gnd 1 2 3 Vin ON/ Vout OFF ON/OFF 1 2 3 4 8 7 6 5
Output Gnd Gnd N/C
MAXIMUM RATINGS
Rating Input Voltage Power Dissipation and Thermal Characteristics TA = 25C Maximum Power Dissipation Case 751 (SOP-8) D Suffix Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case Case 318E (SOT-223) ST Suffix Thermal Resistance, Junction-to-Air Thermal Resistance, Junction-to-Case Output Current Maximum Junction Temperature Operating Ambient Temperature Range Storage Temperature Range Symbol VCC Value 13 Unit Vdc
PD RqJA RqJC RqJA RqJC IO TJ TA Tstg
Internally Limited 160 25 245 15 300 150 - 40 to +125 - 65 to +150
W C/W C/W C/W C/W mA C C C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
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MC33375, NCV33375 Series
ELECTRICAL CHARACTERISTICS (CL = 1.0 mF, TA = 25C, for min/max values TJ = -40C to +125C, Note 1)
Characteristic Output Voltage 1.8 V Suffix 2.5 V Suffix 3.0 V Suffix 3.3 V Suffix 5.0 V Suffix 1.8 V Suffix 2.5 V Suffix 3.0 V Suffix 3.3 V Suffix 5.0 V Suffix Line Regulation Load Regulation IO = 0 mA to 250 mA TA = 25C, Vin = [VO + 1] V Symbol VO Min 1.782 2.475 2.970 3.267 4.950 1.764 2.450 2.940 3.234 4.900 Regline Regload Vin - VO - - Typ 1.80 2.50 3.00 3.30 5.00 - - - - - 2.0 5.0 Max 1.818 2.525 3.030 3.333 5.05 1.836 2.550 3.060 3.366 5.100 10 25 mV mV mV - - - - 65 - - 25 115 220 260 75 160 46 100 200 400 500 - - - dB mVrms Unit Vdc
Vin = [VO + 1] V, 0 < IO < 100 mA 2% Tolerance from TJ = -40 to +125C
Vin = [VO + 1] V to 12 V, IO = 250 mA, All Suffixes TA = 25C Vin = [VO + 1] V, IO = 0 mA to 250 mA, All Suffixes TA = 25C
Dropout Voltage (Note 3) TJ = -40C to +125C IO = 10 mA IO = 100 mA IO = 250 mA IO = 300 mA Ripple Rejection (120 Hz) Vin(peak-peak) = [VO + 1.5] V to [VO + 5.5] V
- Vn
Output Noise Voltage CL = 1.0 mF IO = 50 mA (10 Hz to 100 kHz) CL = 200 mF
CURRENT PARAMETERS
Quiescent Current ON Mode Quiescent Current OFF Mode Quiescent Current ON Mode SAT 1.8 V Suffix 2.5 V Suffix 3.0 V Suffix 3.3 V Suffix 5.0 V Suffix Current Limit Vin = [VO - 0.5] V, IO = 0 mA (Note 2) Vin = [VO + 1] V, IO = 0 mA IQOn IQOff IQSAT - - - - - - - - 125 0.3 1100 1100 1500 1500 1500 450 200 4.0 1500 1500 2000 2000 2000 - mA mA mA
Vin = [VO + 1] V, VO Shorted
ILIMIT
mA
ON/OFF INPUTS
On/Off Input Voltage Logic "1" (Regulator On) Vout = VO 2% Logic "0" (Regulator Off) Vout < 0.03 V Logic "0" (Regulator Off) Vout < 0.05 V (1.8 V Option) VCTRL V 2.4 - - - - - - 0.5 0.3
THERMAL SHUTDOWN
Thermal Shutdown - - 150 - C 1. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. 2. Quiescent Current is measured where the PNP pass transistor is in saturation. Vin = [VO - 0.5] V guarantees this condition. 3. For 1.8 V version VDO is constrained by the minimum input voltage of 2.5 V.
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MC33375, NCV33375 Series
DEFINITIONS Load Regulation - The change in output voltage for a change in load current at constant chip temperature. Dropout Voltage - The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100 mV below its nominal value (which is measured at 1.0 V differential), dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Output Noise Voltage - The RMS AC voltage at the output with a constant load and no input ripple, measured over a specified frequency range. Maximum Power Dissipation - The maximum total dissipation for which the regulator will operate within specifications. Quiescent Current - Current which is used to operate the regulator chip and is not delivered to the load. Line Regulation - The change in output voltage for a change in the input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Maximum Package Power Dissipation - The maximum package power dissipation is the power dissipation level at which the junction temperature reaches its maximum value i.e. 150C. The junction temperature is rising while the difference between the input power (VCC X ICC) and the output power (Vout X Iout) is increasing. Depending on ambient temperature, it is possible to calculate the maximum power dissipation and so the maximum current as following:
T -T Pd + J A R qJA
The maximum operating junction temperature TJ is specified at 150C, if TA = 25C, then PD can be found. By neglecting the quiescent current, the maximum power dissipation can be expressed as:
I out + P D V - Vout CC
The thermal resistance of the whole circuit can be evaluated by deliberately activating the thermal shutdown of the circuit (by increasing the output current or raising the input voltage for example). Then you can calculate the power dissipation by subtracting the output power from the input power. All variables are then well known: power dissipation, thermal shutdown temperature (150C for MC33375) and ambient temperature.
R T -T +J A qJA P D
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MC33375, NCV33375 Series
7 TA = 25 C 6 CL = 0.47 mF IL = 10 mA 5 Vout = 3.3 V 4 50 3 2 1 0 0 20 40 60 80 100 120 140 160 TIME (mS) 0 Vout -50 Vin 200 OUTPUT VOLTAGE CHANGE (mV) 150 100 7 TA = 25 C 6 CL = 33 mF IL = 10 mA 5 Vout = 3.3 V 4 3 2 1 0 0 50 100 TIME (mS) 150 Vout Vin 70 60 50 40 30 20 10 0 -10 -20 200 OUTPUT VOLTAGE CHANGE (mV)
Vin , INPUT VOLTAGE (V)
-100 180 200
Figure 2. Line Transient Response
Vin , INPUT VOLTAGE (V)
Figure 3. Line Transient Response
300 200 100 LOAD CURRENT (mA) 0 -100 -200 -300 -400 CL = 1.0 mF Vout = 3.3 V -500 TA = 25 C -600 Vin = 4.3 V -700 0 50 100 150 Vout CHANGE LOAD CURRENT
1.0 0.8 OUTPUT VOLTAGE CHANGE (V) 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 200 250 300 350 -1.0 400 LOAD CURRENT (mA)
350 250 150 50 -50 -150 -250 -350 -450 -550 -650 -750 0 50 100 150 200 250 300 -0.01 0.14
OUTPUT VOLTAGE CHANGE (V)
LOAD CURRENT
0.09 0.04
Vout CHANGE
CL = 33.0 mF Vout = 3.3 V TA = 25 C Vin = 4.3 V
-0.06 -0.11 -0.16
TIME (mS)
TIME (mS)
Figure 4. Load Transient Response
Figure 5. Load Transient Response
3.5 3.0 OUTPUT VOLTAGE (V) 2.5 2.0 1.5 1.0 0.5 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 INPUT VOLTAGE (V) IL = 1 mA IL = 250 mA
300 250 200 150 100 50 0 1 10 100 1000 IO, OUTPUT CURRENT (mA)
Figure 6. Output Voltage versus Input Voltage
DROPOUT VOLTAGE (mV) 5
Figure 7. Dropout Voltage versus Output Current
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MC33375, NCV33375 Series
300 250 200 Ignd (mA) 150 100 50 0 -40 IL = 250 mA IL = 100 mA IL = 300 mA 12 10 8 6 4 2 IL = 50 mA 25 85 0 0 1 2 3 4 5 6 7 8 Vin (VOLTS) IL = 300 mA
DROPOUT VOLTAGE (mV)
IL = 100 mA
IL = 10 mA 0
TEMPERATURE (C)
Figure 8. Dropout Voltage versus Temperature
Figure 9. Ground Pin Current versus Input Voltage
8 7 6 Vout (VOLTS) Ignd (mA) 5 4 3 2 1 0 -40 -20 0 20 40 60 80 IL = 50 mA 100 120 140 IL = 100 mA IL = 250 mA
2.5 2.495 2.49 2.485 2.48 2.475 2.47 -40 IO = 0
IO = 250 mA
0
25
85
TA (C)
TEMPERATURE (C)
Figure 10. Ground Pin Current versus Ambient Temperature
Figure 11. Output Voltage versus Ambient Temperature (Vin = Vout + 1V)
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MC33375, NCV33375 Series
2.5 2.495 2.49 Vout (VOLTS) 2.485 2.48 2.475 2.47 2.465 -40 0 25 85 IO = 250 mA IO = 0
TEMPERATURE (C)
Figure 12. Output Voltage versus Ambient Temperature (Vin = 12 V)
70 60 50 dB 40 30 20 10 0 0.1 1 10 100 IL = 10 mA IL = 1 mA dB
70 60 50 40 30 20 10 0 0.1 1 10 100 IL = 250 mA IL = 100 mA
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 13. Ripple Rejection
Figure 14. Ripple Rejection
5 4.5 4 VOLTAGE (V) 3.5 3 2.5 2 1.5 1 0.5 0 0 100 200 CL = 1.0 mF
ENABLE
CL = 33 mF
300
400
500
TIME (mS)
Figure 15. Enable Transient
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MC33375, NCV33375 Series
1.8 V Option
1.85 1.84 VOUT , OUTPUT VOLTAGE (V) 1.83 1.82 1.81 1.80 1.79 1.78 1.77 1.76 1.75 -40 ILOAD = 100 mA VOUT, OUTPUT VOLTAGE (V) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 -20 0 20 40 60 80 100 120 0 1 2 3 VCC, (V) 4 TA, AMBIENT TEMPERATURE (C) TA = 25 C ILOAD = 0 mA 5 6
Figure 16. Output Voltage versus Temperature
Figure 17. Output Voltage versus Input Voltage
12 10 8 Ignd , (mA) 6 4 2 0 0 50 100 150 200 250 300 350 ILOAD, (mA) TA = 25 C VCC = 3 V
140 120 100 IQ (m A) 80 60 40 20 0 0 1 2 3 VCC, (V) 4 5 6 TA = 25 C ILOAD = 0 mA
Figure 18. Ground Current versus Load Current
Figure 19. Quiescent Current versus Input Voltage
80 70 60 PSRR (dB) 50 40 30 20 10 0 0.1 1 10 f, FREQUENCY (kHz) 100 1000 0
VCC = 3 V ILOAD = 1 mA TA = 25C COUT = 1 mF 2V
ENABLE VOUT
0V
5
10
15
20
25
30
35
40
45
50
t, TIME (ms)
Figure 20. PSRR versus Frequency
Figure 21. Enable Response
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MC33375, NCV33375 Series
VCC = 3 V ILOAD = 1 mA to 100 mA TA = 25C 1.82 V 1.80 V 1.78 V 100 mA 1 mA
0
0.5
1
1.5
2
2.5 t, TIME (ms)
3
3.5
4
4.5
5
Figure 22. Load Transient Response
APPLICATIONS INFORMATION
ON/OFF Vin MC33375-xx Cin Cout LOAD Vout
GND
Figure 23. Typical Application Circuit
The MC33375 regulators are designed with internal current limiting and thermal shutdown making them user-friendly. Figure 15 is a typical application circuit. The output capability of the regulator is in excess of 300 mA, with a typical dropout voltage of less than 260 mV. Internal protective features include current and thermal limiting.
EXTERNAL CAPACITORS
frequencies. A 0.33 mF or larger tantalum, mylar, ceramic, or other capacitor having low internal impedance at high frequencies should be chosen. The bypass capacitor should be mounted with shortest possible lead or track length directly across the regulator's input terminals. Figure 16 shows the ESR that allows the LDO to remain stable for various load currents.
100 Vout = 3.0 V Cout = 1.0 mF Cin = 1.0 mF
These regulators require only a 0.33 mF (or greater) capacitance between the output and ground for stability for 1.8 V, 2.5 V, 3.0 V, and 3.3 V output voltage options. Output voltage options of 5.0 V require only 0.22 mF for stability. The output capacitor must be mounted as close as possible to the MC33375. If the output capacitor must be mounted further than two centimeters away from the MC33375, then a larger value of output capacitor may be required for stability. A value of 0.68 mF or larger is recommended. Most type of aluminum, tantalum, or multilayer ceramic will perform adequately. Solid tantalums or appropriate multilayer ceramic capacitors are recommended for operation below 25C. An input bypass capacitor is recommended to improve transient response or if the regulator is connected to the supply input filter with long wire lengths, more than 4 inches. This will reduce the circuit's sensitivity to the input line impedance at high
ESR (ohm)
10 Stable Region 1.0
0.1 0 50 100 150 200 250 300 LOAD CURRENT (mA)
Figure 24. ESR for Vout = 3.0V Applications should be tested over all operating conditions to insure stability.
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MC33375, NCV33375 Series
THERMAL PROTECTION
Internal thermal limiting circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated, typically at 150C, the output is disabled. There is no hysteresis built into the thermal protection. As a result the output will appear to be oscillating during thermal limit. The output will turn off until the temperature drops below the 150C then the output turns on again. The process will repeat if the junction increases above the threshold. This will continue until the existing conditions allow the junction to operate below the temperature threshold.
Thermal limit is not a substitute for proper heatsinking.
The internal current limit will typically limit current to 450 mA. If during current limit the junction exceeds 150C, the thermal protection will protect the device also. Current limit is not a substitute for proper heatsinking.
OUTPUT NOISE
In many applications it is desirable to reduce the noise present at the output. Reducing the regulator bandwidth by increasing the size of the output capacitor will reduce the noise on the MC33375.
ON/OFF PIN
When this pin is pulled low, the MC33375 is off. This pin should not be left floating. The pin should be pulled high for the MC33375 to operate.
180 RqJA, THERMAL RESISTANCE, JUNCTION-TO-AIR (CW) 160 140 120 100 80 60 RqJA 0 5.0 Minimum Size Pad PD(max) for TA = 50C 2.0 oz. Copper L L
1.6 1.4 1.2 1.0 0.8 0.6 0.4 30
10 15 20 25 L, LENGTH OF COPPER (mm)
Figure 25. SOT-223 Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length
R JA, THERMAL RESISTANCE, JUNCTIONTOAIR (C/W)
170 150 130 110 90 70 50 30 0 10 RqJA PD(max) for TA = 50C
3.2 2.8 2.4 Graph Represents Symmetrical Layout 2.0 L
2.0 oz. Copper L
1.6 1.2 0.8 0.4
3.0 mm
20
30
40
50
L, LENGTH OF COPPER (mm)
Figure 26. SOP-8 Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length
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PD, MAXIMUM POWER DISSIPATION (W)
IIIIIII IIIIIII IIIIIII
III III III
MC33375, NCV33375 Series
ORDERING INFORMATION
Operating Temperature Range, Tolerance
Device MC33375ST-1.8T3 MC33375ST-1.8T3G NCV33375ST1.8T3G MC33375D-2.5 MC33375D-2.5G MC33375D-2.5R2 MC33375D-2.5R2G NCV33375D-2.5R2G MC33375ST-2.5T3 MC33375ST-2.5T3G MC33375D-3.0 MC33375D-3.0G MC33375D-3.0R2 MC33375D-3.0R2G MC33375ST-3.0T3 MC33375ST-3.0T3G MC33375D-3.3 MC33375D-3.3G MC33375D-3.3R2 MC33375D-3.3R2G MC33375ST-3.3T3 MC33375ST-3.3T3G MC33375D-5.0 MC33375D-5.0G MC33375D-5.0R2 MC33375D-5.0R2G MC33375ST-5.0T3 MC33375ST-5.0T3G
Type 1.8 V (Fixed Voltage)
Package SOT-223 SOT-223 (Pb-Free) SOIC-8 SOIC-8 (Pb-Free) SOIC-8
Shipping
4000 / Tape & Reel
98 Units / Rail
2.5 V (Fixed Voltage)
SOIC-8 (Pb-Free) SOT-223 SOT-223 (Pb-Free) SOIC-8 SOIC-8 (Pb-Free)
2500 / Tape & Reel
4000 / Tape & Reel
98 Units / Rail
3.0 V (Fixed Voltage)
SOIC-8 1% Tolerance at TA = 25C SOIC-8 (Pb-Free) SOT-223 2% Tolerance at TJ from -40 to +125C SOT-223 (Pb-Free) SOIC-8 SOIC-8 (Pb-Free) 98 Units / Rail 4000 / Tape & Reel 2500 / Tape & Reel
3.3 V (Fixed Voltage)
SOIC-8 SOIC-8 (Pb-Free) SOT-223 SOT-223 (Pb-Free) SOIC-8 SOIC-8 (Pb-Free) 98 Units / Rail 4000 / Tape & Reel 2500 / Tape & Reel
5.0 V (Fixed Voltage)
SOIC-8 SOIC-8 (Pb-Free) SOT-223 SOT-223 (Pb-Free) 4000 / Tape & Reel 2500 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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MC33375, NCV33375 Series
DEVICE MARKING
Device MC33375, NCV33375 MC33375, NCV33375 MC33375 MC33375 MC33375 Version 1.8 V 2.5 V 3.0 V 3.3 V 5.0 V Marking (1st line) 37518 37525 37530 37533 37550
TAPE AND REEL SPECIFICATIONS
Device MC33375D, NCV33375D MC33375ST, NCV33375ST Reel Size 13 13 Tape Width 12 mm Embossed Tape 8 mm Embossed Tape Quantity 2500 Units 4000 Units
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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MC33375, NCV33375 Series
PACKAGE DIMENSIONS
SOT-223 (TO-261) CASE 318E-04 ISSUE M
D b1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. MILLIMETERS NOM MAX 1.63 1.75 0.06 0.10 0.75 0.89 3.06 3.20 0.29 0.35 6.50 6.70 3.50 3.70 2.30 2.40 0.94 1.05 1.75 2.00 7.00 7.30 10 - INCHES NOM 0.064 0.002 0.030 0.121 0.012 0.256 0.138 0.091 0.037 0.069 0.276 -
4
HE
E
1 2 3
e1
b e A q L1 C
DIM A A1 b b1 c D E e e1 L1 HE
q
MIN 1.50 0.02 0.60 2.90 0.24 6.30 3.30 2.20 0.85 1.50 6.70 0
MIN 0.060 0.001 0.024 0.115 0.009 0.249 0.130 0.087 0.033 0.060 0.264 0
MAX 0.068 0.004 0.035 0.126 0.014 0.263 0.145 0.094 0.041 0.078 0.287 10
0.08 (0003)
A1
SOLDERING FOOTPRINT*
3.8 0.15 2.0 0.079
2.3 0.091
2.3 0.091
6.3 0.248
2.0 0.079 1.5 0.059
mm inches
SCALE 6:1
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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MC33375, NCV33375 Series
PACKAGE DIMENSIONS
SOIC-8 NB CASE 751-07 ISSUE AJ
-X- A
8 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751-01 THRU 751-06 ARE OBSOLETE. NEW STANDARD IS 751-07. MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244
B
1
S
4
0.25 (0.010)
M
Y
M
-Y- G
K
C -Z- H D 0.25 (0.010)
M SEATING PLANE
N
X 45 _
0.10 (0.004)
M
J
ZY
S
X
S
DIM A B C D G H J K M N S
SOLDERING FOOTPRINT*
1.52 0.060
7.0 0.275
4.0 0.155
0.6 0.024
1.270 0.050
SCALE 6:1
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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MC33375/D

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